DocumentCode
962661
Title
Advanced Method for Monitoring Copper Interconnect Process
Author
Ishikawa, Kensuke ; Nemoto, Kazunori ; Funakoshi, Tomohiro ; Ohta, Hideo
Author_Institution
Micro Device Div., Hitachi Ltd., Ome
Volume
21
Issue
4
fYear
2008
Firstpage
578
Lastpage
584
Abstract
Stabilizing the copper interconnect process is the key to improving yield and reliability. A stable process for forming adequate grains in a copper film is important, but there is no proper method for monitoring the grains in that film. We introduce the micro-haze method, an advanced method for monitoring grain size using scattering light. We experimentally verified the effectiveness of the method and concluded that the method enables the monitoring the grains in a copper film.
Keywords
copper; grain size; integrated circuit interconnections; integrated circuit reliability; light scattering; metallic thin films; size measurement; Cu; copper film; copper interconnect process monitoring; grain monitoring; light scattering; Atomic force microscopy; Copper; Grain boundaries; Grain size; Light scattering; Monitoring; Rough surfaces; Size control; Surface roughness; Transmission electron microscopy; Design of experiment; grain size of copper; micro-haze method; surface roughness;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2008.2005354
Filename
4657431
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