DocumentCode :
962678
Title :
300-mm Prime Gaps That Need to Be Addressed to Boost Productivity
Author :
Marshall, Les ; Rust, Kristin ; Schmidt, Kilian
Author_Institution :
Adv. Micro Devices, Austin, TX
Volume :
21
Issue :
4
fYear :
2008
Firstpage :
592
Lastpage :
599
Abstract :
This paper analyzes 300-mm manufacturing inefficiencies that need to be addressed to improve productivity in the next-generation factory, classifies them into seven general themes, quantifies their business impacts, and identifies specific improvements needed for each as the basis for collaboration between integrated device manufacturers and equipment vendors to address the issues.
Keywords :
integrated circuit manufacture; semiconductor device manufacture; 300-mm manufacturing; prime gaps; size 300 mm; Collaboration; Communication industry; Costs; Lean production; Manufacturing automation; Manufacturing industries; Production facilities; Productivity; Pulp manufacturing; Semiconductor device manufacture; Automation; economics; manufacturing automation; semiconductor device manufacture;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2008.2005363
Filename :
4657433
Link To Document :
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