Title :
External Temperature Effects on Interstitial Instrumentation Therapeutic Heating
Author :
Jarosz, Boguslaw J.
Author_Institution :
Inst. for Phys., Carleton Univ., Ottawa, Ont.
Abstract :
Use of interstitial instrumentation for therapeutic heating is often compromised by uncontrollable thermal washout caused by stochastically distributed heat sinks. The heat sinks effects may be mitigated by, among others, control of the external temperature during the heating. For these procedures temporal characterization becomes crucial. We propose transient finite-element analysis (FEA) simulations as a reliable method of modeling the temporal behavior at different external temperatures. Heating curves obtained in measurements of ultrasonic heating in a brain phantom are modeled using the simulations. On achieving good agreement between the simulation and experimental results, we proceeded with the simulation of heating in a complex head model. Heating efficacy is described in terms of extent and volume of thermal dose. The extent and the volume increased by 40% to 100% for the temperatures of 18 to 47 degC. We found that there is monotonic but nonlinear dependence between the extent and the volume of the thermal dose on external temperature
Keywords :
biomedical equipment; biomedical ultrasonics; biothermics; brain; finite element analysis; phantoms; radiation therapy; 18 to 47 C; external temperature effects; finite-element analysis; interstitial instrumentation; medical instrumentation; stochastically distributed heat sinks; temperature measurement; therapeutic heating; ultrasonic applicators; ultrasonic heating; Analytical models; Brain modeling; Finite element methods; Heat sinks; Heating; Imaging phantoms; Instruments; Temperature control; Transient analysis; Ultrasonic variables measurement; Finite-element analysis (FEA) simulations; head model; interstitial instrumentation; medical instrumentation; temperature measurement; ultrasonic applicators; ultrasonic heating;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.2006.887316