• DocumentCode
    963307
  • Title

    Analysis of back-gate effect on breakdown behaviour of over 600V SOI LDMOS transistors

  • Author

    Qiao, M. ; Zhang, B. ; Li, Z.J. ; Fang, J.

  • Author_Institution
    Univ. of Electron. Sci. & Technol. of China, Chengdu
  • Volume
    43
  • Issue
    22
  • fYear
    2007
  • Abstract
    A novel concept of SOI BG REBULF (back-gate reduced bulk field), which breaks through the limitation of vertical breakdown voltage of lateral high-voltage SOI transistors, is proposed. The mechanism of the improved breakdown behaviour is the reduction of bulk electric field in silicon due to field-modulated effect of the interface charges induced by the back-gate voltage. The impact of the back-gate bias on the breakdown behaviour of over 600 V SOI LDMOS transistors is discussed. When the back-gate bias is 330 V the breakdown voltage of the BG REBULF SOI LDMOS is 1020 V which is 47.8% greater than that of the conventional SOI LDMOS.
  • Keywords
    MOSFET; semiconductor device breakdown; silicon-on-insulator; SOI LDMOS transistors; back-gate effect; back-gate reduced bulk field; breakdown behaviour; vertical breakdown voltage; voltage 600 V;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20071978
  • Filename
    4375471