Title :
Microminiaturization Techniques
Author :
Finkelstein, Martin J.
Author_Institution :
MF Electronics
fDate :
8/1/1959 12:00:00 AM
Abstract :
THE need of microminiaturization is discussed, and the first approach to the problem is introduced. Tiny active component assemblies, with extremely high packaging-densities are described. The method of assembly and testing is necessarily unique because the smallest available component parts which must be used are difficult to wire and trouble-shoot. Some conclusions regarding principles of construction are put forth.
Keywords :
Assembly; Computer aided manufacturing; Electronic equipment manufacture; Electronics packaging; Helium; Industrial electronics; Missiles; Pulp manufacturing; Testing; Wire;
Journal_Title :
Production Techniques, IRE Transactions on
DOI :
10.1109/TPGPT.1959.1136050
