DocumentCode
963821
Title
A fractal analysis of interconnection complexity
Author
Christie, Phillip
Author_Institution
Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
Volume
81
Issue
10
fYear
1993
fDate
10/1/1993 12:00:00 AM
Firstpage
1492
Lastpage
1499
Abstract
The emergent, collective properties of computer interconnections are shown to be characterized by a noninteger dimension D i , which is, in general, different from the system´s Euclidean dimension. This dimension characterizes the properties of a fractal support, or substrate, on which interconnections are placed to provide communication throughout the system. The interconnection support also acts as a host for a multifractal spectrum of interconnection distribution processes which characterize the change in connectivity in moving from the backplane to the transistor level. The properties of fractal systems are investigated by attempting to minimize their total wire length using a simulated annealing algorithm. Systems whose interconnection dimension is approximately equal to their Euclidean dimension are shown to possess minimum wire length arrangements. These results are then interpreted in terms of a geometrical temperature T i=1/D i. This analysis indicates that the system passes through a phase transition at T i≈1/2 and that attainable system temperatures are bounded by 1/3⩽T i⩽1. The consequences for simulated annealing are discussed
Keywords
fractals; multiprocessor interconnection networks; simulated annealing; backplane; collective properties; computer interconnections; fractal support; geometrical temperature; interconnection complexity; minimum wire length arrangements; multifractal spectrum; noninteger dimension; phase transition; simulated annealing; simulated annealing algorithm; total wire length; transistor level; Boundary conditions; Computational modeling; Entropy; Fractals; Integrated circuit interconnections; Maxwell-Boltzmann distribution; Simulated annealing; Space heating; Temperature; Wire;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.241509
Filename
241509
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