• DocumentCode
    963821
  • Title

    A fractal analysis of interconnection complexity

  • Author

    Christie, Phillip

  • Author_Institution
    Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
  • Volume
    81
  • Issue
    10
  • fYear
    1993
  • fDate
    10/1/1993 12:00:00 AM
  • Firstpage
    1492
  • Lastpage
    1499
  • Abstract
    The emergent, collective properties of computer interconnections are shown to be characterized by a noninteger dimension Di , which is, in general, different from the system´s Euclidean dimension. This dimension characterizes the properties of a fractal support, or substrate, on which interconnections are placed to provide communication throughout the system. The interconnection support also acts as a host for a multifractal spectrum of interconnection distribution processes which characterize the change in connectivity in moving from the backplane to the transistor level. The properties of fractal systems are investigated by attempting to minimize their total wire length using a simulated annealing algorithm. Systems whose interconnection dimension is approximately equal to their Euclidean dimension are shown to possess minimum wire length arrangements. These results are then interpreted in terms of a geometrical temperature T i=1/Di. This analysis indicates that the system passes through a phase transition at Ti≈1/2 and that attainable system temperatures are bounded by 1/3⩽Ti⩽1. The consequences for simulated annealing are discussed
  • Keywords
    fractals; multiprocessor interconnection networks; simulated annealing; backplane; collective properties; computer interconnections; fractal support; geometrical temperature; interconnection complexity; minimum wire length arrangements; multifractal spectrum; noninteger dimension; phase transition; simulated annealing; simulated annealing algorithm; total wire length; transistor level; Boundary conditions; Computational modeling; Entropy; Fractals; Integrated circuit interconnections; Maxwell-Boltzmann distribution; Simulated annealing; Space heating; Temperature; Wire;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.241509
  • Filename
    241509