Title :
Thermal Design Solutions for Micro-Modular Equipment
Author :
Rezek, Gerard ; Taylor, Paul K.
Author_Institution :
Surface Communications Division, R. C. A.
fDate :
6/1/1961 12:00:00 AM
Keywords :
Assembly; Circuits; Communication industry; Conducting materials; Construction industry; Heat transfer; Surface resistance; Temperature; Thermal resistance; Wires;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1961.1136122
