DocumentCode

964129

Title

Epoxy Resin Molds for Encapsulating Electronic Circuitry into Modules

Author

Tallent, John J.

Author_Institution

General Electric Co., Light Military Electronics Department

Volume

5

Issue

2

fYear

1961

fDate

6/1/1961 12:00:00 AM

Firstpage

98

Lastpage

103

Keywords

Circuits; Design engineering; Encapsulation; Epoxy resins; Heat transfer; Maintenance engineering; Manufacturing; Reliability engineering; Resistance heating; Shape;

fLanguage

English

Journal_Title

Product Engineering and Production, IRE Transactions on

Publisher

ieee

ISSN

0096-1760

Type

jour

DOI

10.1109/TPEP.1961.1136125

Filename

1136125