• DocumentCode
    964735
  • Title

    Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

  • Author

    Engelmaier, Werner

  • Author_Institution
    Bell Laboratories, Whippany, NJ, USA
  • Volume
    6
  • Issue
    3
  • fYear
    1983
  • fDate
    9/1/1983 12:00:00 AM
  • Firstpage
    232
  • Lastpage
    237
  • Abstract
    An ana1ytica1 method is described which provides estimates to first order of the number of either power or envirnnmenta1 cyc1es 1eading to so1der joint fai1ure. Vari0us parameter variations such as so1der joint height, ceramic chip carrier (CCC) size, printed c1rcuit substrate (PCS) materia1, etc. are investigated and discussed and samp1e estimates for a 0.65 x 0.65-in CCC are given.
  • Keywords
    Integrated circuit thermal factors; Integrated-circuit reliability testing; Printed circuits; Soldering; Capacitive sensors; Ceramics; Fatigue; Lead; Personal communication networks; Printed circuits; Soldering; Steady-state; Temperature; Thermal expansion;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1983.1136183
  • Filename
    1136183
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=964735