DocumentCode
964758
Title
Analysis of Surface Mount Thermal and Thermal Stress Performance
Author
Waller, Debra L. ; Fox, Leslie R. ; Hannemann, Robert J.
Author_Institution
Digital Equipment Corporation, Andover, MA, USA
Volume
6
Issue
3
fYear
1983
fDate
9/1/1983 12:00:00 AM
Firstpage
257
Lastpage
266
Abstract
Ongoing analysis of leadless ceramic devices surface mounted to epoxy-glass is described. Finite element (FE) model results for thermal resistance as a function of airspeed, carrier size and spacing, and heatsinking are given. An overview of the thermal stress problem, emphasizing fatigue test design, is presented. The rationales used in choosing thermal cycle amplitudes, methods of heat transfer, definitions of failure, test frequency, and desired cycles to failure are compared to current industry practice and discussed in the context of their impact on test results.
Keywords
Ceramic materials/devices; FEM; Finite-element method (FEM); Integrated circuit thermal factors; Integrated-circuit reliability testing; Printed circuits; Soldering; Ceramics; Fatigue; Finite element methods; Heat transfer; Performance analysis; Resistance heating; Surface resistance; Testing; Thermal resistance; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1983.1136186
Filename
1136186
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