• DocumentCode
    964788
  • Title

    Improved Electrical Performance Required for Future MOS Packaging

  • Author

    Schaper, Leonard W. ; Amey, Daniel I.

  • Author_Institution
    Bell Laboratories, Murray hill, NJ, USA
  • Volume
    6
  • Issue
    3
  • fYear
    1983
  • fDate
    9/1/1983 12:00:00 AM
  • Firstpage
    283
  • Lastpage
    289
  • Abstract
    High speed integrated circuit (IC) families and the demands which these devices place on interconnection and power systems are compared, concluding that new materials, components, and packaging techniques are required to provide a nonlimiting electrical environment for high performance systems using metal-oxide semiconductor (MOS) technologies.
  • Keywords
    Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; MOS integrated circuits; CMOS logic circuits; CMOS technology; Frequency; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit packaging; MOS devices; Power supplies; Power system interconnection; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1983.1136189
  • Filename
    1136189
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=964788