• DocumentCode
    9648
  • Title

    Statistical SBD Modeling and Characterization and Its Impact on SRAM Cells

  • Author

    Soo Young Kim ; Chih-Hsiang Ho ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    61
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan. 2014
  • Firstpage
    54
  • Lastpage
    59
  • Abstract
    In this paper, we present a physics-based SPICE model for statistical soft breakdown (SBD) in ultrathin oxide. Statistical SBD induces an increase in gate leakage current (IG_BD) based on the time to breakdown (tBD) and the location of the percolation path in the channel. The proposed model has been validated with experimental data, and fed into circuit simulators to predict the degradation of device/circuit performance. Using the model, we analyzed the impact of the increased IG_BD due to the first SBD on cell stability and performance in SRAM cells. We observed that IG_BD variation due to SBD increases READ and WRITE failure probability, resulting in reduced lifetime.
  • Keywords
    SPICE; SRAM chips; statistical analysis; SRAM cells; WRITE failure probability; cell stability; circuit simulators; degradation; device/circuit performance; gate leakage current; percolation path; physics based SPICE model; statistical SBD modeling; statistical soft breakdown; ultrathin oxide; Analytical models; Degradation; Integrated circuit modeling; Logic gates; SRAM cells; Stability analysis; Stress; Soft breakdown (SBD); static random access memory (SRAM); time-dependent dielectric breakdown (TDDB);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2292060
  • Filename
    6678540