DocumentCode
9648
Title
Statistical SBD Modeling and Characterization and Its Impact on SRAM Cells
Author
Soo Young Kim ; Chih-Hsiang Ho ; Roy, Kaushik
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
61
Issue
1
fYear
2014
fDate
Jan. 2014
Firstpage
54
Lastpage
59
Abstract
In this paper, we present a physics-based SPICE model for statistical soft breakdown (SBD) in ultrathin oxide. Statistical SBD induces an increase in gate leakage current (IG_BD) based on the time to breakdown (tBD) and the location of the percolation path in the channel. The proposed model has been validated with experimental data, and fed into circuit simulators to predict the degradation of device/circuit performance. Using the model, we analyzed the impact of the increased IG_BD due to the first SBD on cell stability and performance in SRAM cells. We observed that IG_BD variation due to SBD increases READ and WRITE failure probability, resulting in reduced lifetime.
Keywords
SPICE; SRAM chips; statistical analysis; SRAM cells; WRITE failure probability; cell stability; circuit simulators; degradation; device/circuit performance; gate leakage current; percolation path; physics based SPICE model; statistical SBD modeling; statistical soft breakdown; ultrathin oxide; Analytical models; Degradation; Integrated circuit modeling; Logic gates; SRAM cells; Stability analysis; Stress; Soft breakdown (SBD); static random access memory (SRAM); time-dependent dielectric breakdown (TDDB);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2292060
Filename
6678540
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