For Hybrids: A Way to Higher Chip Yields

A procedure by which a program was developed and carried out to improve chip yields for hybrid microcircuits is described. Once the need for improvement was established, steps were taken to identify those areas with potentially high payback in cost and reliability. Chips with small bonding pads were redesigned to a larger pad, enabling easier targeting and second/third bonding chances. Extensive investigations were conducted into contamination, workmanship, receiving inspection, and engineering. Every area was found to be a fertile field for improvements and the resulting corrective action program has been shown to sharply improve yields.