A Cost-Effective High-Performance Alternative to Conventional Gold Plating on Connector Contacts

Two approaches have been used with some success to counter the effects of the high and volatile costs of gold as used in electronic connectors. One emphasizes gold conservation, using selective plating techniques wherever applicable and reduced-thickness coatings where possible. That approach is reviewed, and the successes and practical limitations pointed out. The other approach, to develop alternative materials, particularly palladium, is also discussed. Functional problems, some confirmed and others anticipated, have limited the general applicability of this approach. A third approach has proved very successful. Palladium plating was developed, not as a surface contact material, but as an additional barrier undercoat for gold. This approach is shown to permit ultra-thin gold surface layers to be used, with performance properties equal to and in some respects superior to conventional gold platings. Production prototype data are provided for an optimized composite layered coating which we call AMP-Duragold.®