A method of adhesion strength test for thick film

Author

Yata, Kunio ; Enokido, Yasushi ; Yamaguchi, Takashi

Author_Institution

Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan

Volume

16

Issue

6

fYear

1993

fDate

9/1/1993 12:00:00 AM

Firstpage

584

Lastpage

591

Abstract

An adhesion strength test for thick films that requires no soldering was developed, and the adhesion strength of a silver-glass thick film on an alumina substrate was obtained. Three types of adhesion strengths were considered: prefracture adhesion strength, fracture process adhesion strength, and total adhesion strength, which is the sum of the other two adhesion strengths. The relation between these adhesion strengths and the microstructure is discussed. The strength of glass, the thickness of the glass layer, and densification of the silver powder are proposed as possible factors responsible for adhesion strength. A fracture mechanism for thick films, based on an analysis of the adhesion strength and observation of the microstructure, is proposed. Adhesion strength is evaluated using the Weibull distribution function

Keywords

adhesion; borosilicate glasses; electrodes; fracture toughness testing; integrated circuit technology; silver; thick film devices; Ag-PbOB2O3-SiO2-Al2O3; Ag-PbOBSG-Al₂O₃; Al₂O₃; Weibull distribution function; adhesion strength test; densification; fracture process; glass; microstructure; prefracture; total adhesion strength; Adhesives; Glass; Microstructure; Powders; Silver; Soldering; Substrates; Testing; Thick films; Weibull distribution;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.241783

Filename

241783