Wafer-scale integration using restructurable VLSI

Author

Anderson, Allan H. ; Raffel, Jack I. ; Wyatt, Peter W.

Author_Institution

MIT Lincoln Lab., Lexington, MA, USA

Volume

25

Issue

4

fYear

1992

fDate

4/1/1992 12:00:00 AM

Firstpage

41

Lastpage

47

Abstract

Results from a restructurable very large scale integration (RVLSI) program show the viability of using a laser to restructure wafer-scale circuits for customization and defect avoidance. Wafer-scale circuits are built with a standard integrated circuit fabrication process when the diffused-link restructuring device is used. Nine wafer-scale systems that have been built using the RVLSI technique are described. It is shown that the laser interconnection process has high yield and provides the high reliability of monolithic circuitry. The technology is well suited to signal processing systems, which characteristically use many replications of a small number of circuits and often have modest interconnection requirements.<>

Keywords

VLSI; integrated circuit technology; optical interconnections; diffused-link restructuring; laser interconnection process; restructurable very large scale integration; wafer-scale circuits; Circuit testing; Clocks; Filters; Foundries; Integrated circuit interconnections; Laboratories; Optical device fabrication; Signal design; Very large scale integration; Wafer scale integration;

fLanguage

English

Journal_Title

Computer

Publisher

ieee

ISSN

0018-9162

Type

jour

DOI

10.1109/2.129046

Filename

129046