DocumentCode
965427
Title
Analytical Calculation of Metallized-Hole Resistance
Author
Abbas, S.A. ; Weeks, William T.
Author_Institution
IBM Corp.
Volume
6
Issue
1
fYear
1970
fDate
3/1/1970 12:00:00 AM
Firstpage
26
Lastpage
35
Abstract
The resistance of metallized holes which connect diffcrent levels of metallization in an electronic package, is calculated by solving the 3-dimensional Laplace equation. The metallized hole considered is cylindrical with current flowing in and out through conducting lines. Four configurations are studied. Extensive tables giving normalized values of resistance haw; been obtained through computer calculation. The dimensions of the metallized hole and conductors are normalized with respect to the height of the hole, and in this way a wide range of geometries is dealt with. One important observation from these calculations is the strong dependence of the resistance on the geometry of the conductors carrying the current in and out of the metallized hole. An average current density can be obtained through the use of an equivalent conductor resistance for the metallized hole.
Keywords
Boundary conditions; Current density; Electrical resistance measurement; Guidelines; Joining processes; Laplace equations; Mathematical analysis; Metallization; Pattern analysis; Wiring;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1970.1136252
Filename
1136252
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