DocumentCode
965654
Title
Physical Aspects of Logical Devices
Author
Lundstrom, S.F. ; Cowart, B.E.
Author_Institution
Automation Technology, Incorporated
Volume
5
Issue
1
fYear
1972
Firstpage
25
Lastpage
30
Abstract
Logic devices affect system design in many ways in addition to implementing the desired logic functions. With the high-speed circuits available today, the system designer must pay careful attention to the implications of the logic devices on signal interconnections, packaging and cooling as well as power generation and distribution. Wire is no longer a resistive element in the circuit; it may have significant capacitive and inductive properties at the frequencies of use. This paper considers how many of these factors are related and presents some of the approaches being made to solve these problems.
Keywords
Cooling; Frequency; Integrated circuit interconnections; Logic devices; Logic functions; Packaging; Power generation; Power system interconnection; Signal design; Wire;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/C-M.1972.216864
Filename
1641498
Link To Document