• DocumentCode
    965654
  • Title

    Physical Aspects of Logical Devices

  • Author

    Lundstrom, S.F. ; Cowart, B.E.

  • Author_Institution
    Automation Technology, Incorporated
  • Volume
    5
  • Issue
    1
  • fYear
    1972
  • Firstpage
    25
  • Lastpage
    30
  • Abstract
    Logic devices affect system design in many ways in addition to implementing the desired logic functions. With the high-speed circuits available today, the system designer must pay careful attention to the implications of the logic devices on signal interconnections, packaging and cooling as well as power generation and distribution. Wire is no longer a resistive element in the circuit; it may have significant capacitive and inductive properties at the frequencies of use. This paper considers how many of these factors are related and presents some of the approaches being made to solve these problems.
  • Keywords
    Cooling; Frequency; Integrated circuit interconnections; Logic devices; Logic functions; Packaging; Power generation; Power system interconnection; Signal design; Wire;
  • fLanguage
    English
  • Journal_Title
    Computer
  • Publisher
    ieee
  • ISSN
    0018-9162
  • Type

    jour

  • DOI
    10.1109/C-M.1972.216864
  • Filename
    1641498