DocumentCode :
965654
Title :
Physical Aspects of Logical Devices
Author :
Lundstrom, S.F. ; Cowart, B.E.
Author_Institution :
Automation Technology, Incorporated
Volume :
5
Issue :
1
fYear :
1972
Firstpage :
25
Lastpage :
30
Abstract :
Logic devices affect system design in many ways in addition to implementing the desired logic functions. With the high-speed circuits available today, the system designer must pay careful attention to the implications of the logic devices on signal interconnections, packaging and cooling as well as power generation and distribution. Wire is no longer a resistive element in the circuit; it may have significant capacitive and inductive properties at the frequencies of use. This paper considers how many of these factors are related and presents some of the approaches being made to solve these problems.
Keywords :
Cooling; Frequency; Integrated circuit interconnections; Logic devices; Logic functions; Packaging; Power generation; Power system interconnection; Signal design; Wire;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/C-M.1972.216864
Filename :
1641498
Link To Document :
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