Title :
High Production Encapsulation of Electronic Devices
Author :
Zecher, Robert F.
Author_Institution :
Hull Corporation , Hatboro PA
fDate :
7/1/1962 12:00:00 AM
Keywords :
Curing; Electronics packaging; Encapsulation; Manufacturing processes; Production; Protection; Resins; Seals; Temperature; Transfer molding;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136303
