DocumentCode
965978
Title
Technology of superconducting thin films on Si, SiO2, and Si3N4 for vacuum microelectronics
Author
Aslam, Mohammad ; Soltis, Richard E. ; Logothetis, E.M. ; Chase, Richard E. ; Wenger, Lowell E. ; Chen, J.T.
Author_Institution
Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
Volume
36
Issue
11
fYear
1989
fDate
11/1/1989 12:00:00 AM
Firstpage
2693
Lastpage
2696
Abstract
A study of YBaCuO films on Si, SiO2, and Si3N4 substrates demonstrates that rapid thermal processing can suppress the film-substrate reaction during the postgrowth oxygen annealing. By increasing the copper content of YBaCuO films that are sputter-deposited on SiO2/Si to correspond to the 1:2:3 metal composition, the authors have achieved an onset of superconductivity above 95 K and a Tc(0) above 70 K through a rapid oxygen anneal for 6 s at 940 degrees C without a nitrogen preanneal. These results as well as results of others suggest that high Tc oxide superconductors could be used as electron sources or as cold emitters, gates, and collectors.
Keywords
annealing; barium compounds; electron field emission; electron sources; high-temperature superconductors; sputtered coatings; superconducting thin films; vacuum tubes; yttrium compounds; 70 to 95 K; 940 degC; Si; Si3N4; SiO2; YBaCuO-Si; YBaCuO-Si3N4-Si; YBaCuO-SiO2-Si; cold emitters; collectors; electron sources; field emission; gates; high Tc oxide superconductors; high temperature superconductors; integrated vacuum tubes; postgrowth O2 annealing; rapid thermal processing; sputter-deposited; superconducting thin films; vacuum microelectronics; Buffer layers; Electron sources; High temperature superconductors; Microelectronics; Nitrogen; Rapid thermal annealing; Rapid thermal processing; Semiconductor films; Superconducting films; Superconducting materials; Superconducting thin films; Superconductivity; Vacuum technology; Yttrium barium copper oxide;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.43774
Filename
43774
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