Title :
A Technique for Transient Thermal Prediction in Microminiaturized Circuits
Author_Institution :
Martin Company, Orlando
fDate :
7/1/1962 12:00:00 AM
Keywords :
Circuits; Cooling; Costs; Difference equations; Geometry; Heat transfer; Mathematical model; Packaging; Predictive models; Temperature;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136306
