DocumentCode

966128

Title

Pros and Cons of 3-D Welded Cordwood Packaging

Author

Oswald, Anton

Author_Institution

Electronics Laboratory, Kearfott Division, General Precision Aerospace

Volume

6

Issue

4

fYear

1962

fDate

12/1/1962 12:00:00 AM

Firstpage

24

Lastpage

31

Keywords

Aerospace electronics; Electronics packaging; Glass; Laboratories; Nickel; Printed circuits; Resistors; Semiconductor diodes; Semiconductor films; Welding;

fLanguage

English

Journal_Title

Product Engineering and Production, IRE Transactions on

Publisher

ieee

ISSN

0096-1760

Type

jour

DOI

10.1109/TPEP.1962.1136319

Filename

1136319