DocumentCode
966507
Title
A Further Study on the Microstructure of Glass-Bonded Ag Thick-Film Conductors
Author
Yajima, Koh-ichi ; Yamaguchi, Takashi
Author_Institution
Keio University, Japan
Volume
7
Issue
3
fYear
1984
fDate
9/1/1984 12:00:00 AM
Firstpage
281
Lastpage
285
Abstract
The sintering and microstructure development of glassbonded Ag thick-film conductors have been studied with special emphasis on the effects of glass-Ag ratio, film thickness, and substrate material. Techniques employed are dilatometry, microscopy, and electron probe microanalysis (EPMA). The variation of surface silver concentration has been well correlated with the microstructure, and the experimental results have been interpreted successfully in terms of the behavior of glass phase during firing.
Keywords
Silver materials/devices; Thick films; Conducting materials; Conductive films; Conductors; Electron microscopy; Firing; Glass; Microstructure; Probes; Silver; Substrates;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1984.1136356
Filename
1136356
Link To Document