Title :
A Further Study on the Microstructure of Glass-Bonded Ag Thick-Film Conductors
Author :
Yajima, Koh-ichi ; Yamaguchi, Takashi
Author_Institution :
Keio University, Japan
fDate :
9/1/1984 12:00:00 AM
Abstract :
The sintering and microstructure development of glassbonded Ag thick-film conductors have been studied with special emphasis on the effects of glass-Ag ratio, film thickness, and substrate material. Techniques employed are dilatometry, microscopy, and electron probe microanalysis (EPMA). The variation of surface silver concentration has been well correlated with the microstructure, and the experimental results have been interpreted successfully in terms of the behavior of glass phase during firing.
Keywords :
Silver materials/devices; Thick films; Conducting materials; Conductive films; Conductors; Electron microscopy; Firing; Glass; Microstructure; Probes; Silver; Substrates;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1984.1136356
