• DocumentCode
    966742
  • Title

    A zero-Insertion-Force Hybrid Circuit Connector for Severe Environments

  • Author

    Sinclair, Paul

  • Author_Institution
    Microsystems Design, Clear Lake Shores, TX
  • Volume
    7
  • Issue
    4
  • fYear
    1984
  • fDate
    12/1/1984 12:00:00 AM
  • Firstpage
    378
  • Lastpage
    383
  • Abstract
    A new packaging technology has been developed for complex electronic circuits used in the high-temperature high-vibration environment of oil-well logging instrumentation. Specifically, the design and testing of a 72-pin connector that operates with large area ceramic substrates carrying leadless chip-carrier (LCC) devices and other thick film components is considered. The emphasis is on achieving high mechanical and electrical integrity during exposure to severe stress, while allowing easy field replacement of defective hybrid circuits without the need for any special tools to operate the release mechanism. A combination of mechanical shock (100 g levels) and vibration (10 g) with an extreme operating temperature range (- 55 to + 200°C) requires care in the choice of materials and the solution of some special design problems.
  • Keywords
    Connectors; Hybrid integrated circuit packaging; Hybrid integrated circuit thermal factors; Mechanical factors; Ceramics; Circuit testing; Connectors; Electric shock; Electronic circuits; Electronics packaging; Instruments; Stress; Substrates; Thick films;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1984.1136377
  • Filename
    1136377