DocumentCode
966742
Title
A zero-Insertion-Force Hybrid Circuit Connector for Severe Environments
Author
Sinclair, Paul
Author_Institution
Microsystems Design, Clear Lake Shores, TX
Volume
7
Issue
4
fYear
1984
fDate
12/1/1984 12:00:00 AM
Firstpage
378
Lastpage
383
Abstract
A new packaging technology has been developed for complex electronic circuits used in the high-temperature high-vibration environment of oil-well logging instrumentation. Specifically, the design and testing of a 72-pin connector that operates with large area ceramic substrates carrying leadless chip-carrier (LCC) devices and other thick film components is considered. The emphasis is on achieving high mechanical and electrical integrity during exposure to severe stress, while allowing easy field replacement of defective hybrid circuits without the need for any special tools to operate the release mechanism. A combination of mechanical shock (100 g levels) and vibration (10 g) with an extreme operating temperature range (- 55 to + 200°C) requires care in the choice of materials and the solution of some special design problems.
Keywords
Connectors; Hybrid integrated circuit packaging; Hybrid integrated circuit thermal factors; Mechanical factors; Ceramics; Circuit testing; Connectors; Electric shock; Electronic circuits; Electronics packaging; Instruments; Stress; Substrates; Thick films;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1984.1136377
Filename
1136377
Link To Document