Title :
Thermal Stress-Free Package for Flip-Chip Devices
Author :
Kohara, Masanobu ; Hatta, Muneo ; Genjyo, Hideki ; Shibata, Hiroshi ; Nakata, Hidefumi
Author_Institution :
Mitsubishi Elec. Corp., Hyogo-Pref, Japan
fDate :
12/1/1984 12:00:00 AM
Abstract :
The purpose is to investigate the origin of technical progress as a result of the entropy law, to find its limitations, and to discover its best use.
Keywords :
Integrated circuit packaging; Integrated circuit thermal factors; Bonding; Ceramics; Electronic packaging thermal management; Integrated circuit packaging; Large scale integration; Silicon carbide; Thermal conductivity; Thermal expansion; Thermal resistance; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1984.1136382
