DocumentCode
967114
Title
Large Silicon Slice Mounting
Author
Olson, D.L. ; Koliwad, K.M.
Author_Institution
Ohio State Univ.
Volume
7
Issue
2
fYear
1971
fDate
6/1/1971 12:00:00 AM
Firstpage
76
Lastpage
80
Abstract
The effects of thermal expansion incompatibility between silicon slices and various metal substrates are described for adhesive and solder joints. Dependable solder and adhesive joints have been achieved in mounting two-inch silicon slices. The size of the sillcon slices that can be solder or adhesive mounted to various substrates and withstand a specified temperature change was experimentally determined. Extrapolation of the present results can predict the suitability of substrate material for mounting larger than 2-in silicon slices. A one-dimensional theoretical model was found to describe the trends of the experimental data.
Keywords
Ceramics; Circuits; Extrapolation; Silicon; Soldering; Steel; Substrates; Temperature; Testing; Thermal expansion;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1971.1136413
Filename
1136413
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