Title :
Bond integrity evaluation using transmission scanning acoustic microscopy
Author :
Sinclair, D.A. ; Ash, E.A.
Author_Institution :
University College London, Department of Electronic & Electrical Engineering, London, UK
Abstract :
Low frequency transmission scanning acoustic microscopy is capable of revealing voids and delaminations at substantial depths inside a solid material. The technique is demonstrated with reference to the bond between a carbon diamond compound sintered to a steel base. A resolution comparable to the wavelength inside the solid material is achieved.
Keywords :
acoustic microscopes; diamond; nondestructive testing; voids (solid); bond integrity evaluation; carbon diamond compound; delaminations; transmission scanning acoustic microscopy; voids;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19800628
