DocumentCode :
967937
Title :
Electrical Parameter Analysis from Three-Dimensional Interconnection Geometry
Author :
Kamikawai, Ryotaro ; Nishi, Masaaki ; Nakanishi, Keiichiro ; Masaki, Akira
Author_Institution :
Hitachi Ltd., Kokubunji, Tokyo, Japan
Volume :
8
Issue :
2
fYear :
1985
fDate :
6/1/1985 12:00:00 AM
Firstpage :
269
Lastpage :
274
Abstract :
TRISIM1, a capacitance and inductance calculation program for complex three-dimensional geometries, is described. The basic algorithm of capacitance calculation is Green´s function integral equation method and the inductances are calculated by Neumann´s formula applied to the thin filaments which make up the conductor segment. In TRISIM1, for efficient use of these algorithms, 1) triangular capacitance cells are adopted, 2) the calculation of the matrix element Gijis simplified according to the cell distance, and 3) the filaments for inductance calculation are infinitely thin. An approximate method of filament selfinductance calculation is used and the proof of its validity is given. The convergence of the numerical results to analytical or two-dimensional solutions is illustrated for simple geometries. The crosstalk noise induced among connector pins is calculated and the results are in good agreement with the measured data.
Keywords :
Capacitance calculations; Inductance calculations; Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; Capacitance; Conductors; Connectors; Convergence of numerical methods; Crosstalk; Geometry; Green´s function methods; Inductance; Integral equations; Pins;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1985.1136497
Filename :
1136497
Link To Document :
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