• DocumentCode
    967981
  • Title

    A unified TLM model for wave propagation of electrical and optical structures considering permittivity and permeability tensors

  • Author

    Huang, Jifu ; Wu, Ke

  • Author_Institution
    Res. Center for Adv. Microwave & Space Electron., Ecole Polytech. de Montreal, Que., Canada
  • Volume
    43
  • Issue
    10
  • fYear
    1995
  • fDate
    10/1/1995 12:00:00 AM
  • Firstpage
    2472
  • Lastpage
    2477
  • Abstract
    A generalized transmission line matrix (TLM) formalism is proposed for unified simulation of wave propagation problems. The present modeling is made possible with a new TLM node that is derived to account for simultaneously the electromagnetic effects of permittivity and permeability tensors of material. It is shown, through numerical examples, that the new node-based TLM algorithm in the frequency domain can be used to solve a large class of complex electromagnetic problems ranging from microwave circuits to optical devices. A dynamic solution for the r-cut sapphire-based microstrip is presented that highlights its application to high-temperature superconducting microwave circuits
  • Keywords
    electromagnetic wave propagation; magnetic permeability; permittivity; transmission line matrix methods; waveguide theory; HTSC microwave circuits; TLM node; complex EM problems; electrical structures; electromagnetic effects; frequency domain analysis; high-temperature superconducting circuits; node-based TLM algorithm; optical structures; permeability tensors; permittivity tensors; r-cut sapphire-based microstrip; transmission line matrix formalism; unified TLM model; unified simulation; wave propagation; Electromagnetic modeling; Electromagnetic propagation; Microwave circuits; Optical propagation; Permeability; Permittivity; Superconducting microwave devices; Superconducting transmission lines; Tensile stress; Transmission line matrix methods;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.466182
  • Filename
    466182