DocumentCode :
967981
Title :
A unified TLM model for wave propagation of electrical and optical structures considering permittivity and permeability tensors
Author :
Huang, Jifu ; Wu, Ke
Author_Institution :
Res. Center for Adv. Microwave & Space Electron., Ecole Polytech. de Montreal, Que., Canada
Volume :
43
Issue :
10
fYear :
1995
fDate :
10/1/1995 12:00:00 AM
Firstpage :
2472
Lastpage :
2477
Abstract :
A generalized transmission line matrix (TLM) formalism is proposed for unified simulation of wave propagation problems. The present modeling is made possible with a new TLM node that is derived to account for simultaneously the electromagnetic effects of permittivity and permeability tensors of material. It is shown, through numerical examples, that the new node-based TLM algorithm in the frequency domain can be used to solve a large class of complex electromagnetic problems ranging from microwave circuits to optical devices. A dynamic solution for the r-cut sapphire-based microstrip is presented that highlights its application to high-temperature superconducting microwave circuits
Keywords :
electromagnetic wave propagation; magnetic permeability; permittivity; transmission line matrix methods; waveguide theory; HTSC microwave circuits; TLM node; complex EM problems; electrical structures; electromagnetic effects; frequency domain analysis; high-temperature superconducting circuits; node-based TLM algorithm; optical structures; permeability tensors; permittivity tensors; r-cut sapphire-based microstrip; transmission line matrix formalism; unified TLM model; unified simulation; wave propagation; Electromagnetic modeling; Electromagnetic propagation; Microwave circuits; Optical propagation; Permeability; Permittivity; Superconducting microwave devices; Superconducting transmission lines; Tensile stress; Transmission line matrix methods;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.466182
Filename :
466182
Link To Document :
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