• DocumentCode
    968121
  • Title

    Method of dissipating heat generated in high-voltage CMOS driver IC

  • Author

    Do, H.-L. ; Ok, C.-Y.

  • Author_Institution
    Digital PDP Div., LG Electron. Inc., Gongdan-Dong, South Korea
  • Volume
    42
  • Issue
    12
  • fYear
    2006
  • fDate
    6/8/2006 12:00:00 AM
  • Firstpage
    684
  • Lastpage
    685
  • Abstract
    A method of dissipating the heat generated in a high-voltage CMOS driver IC, which is designed for use with a flat panel display, is proposed. It utilises a charge pump circuit to reduce the voltage across the driver IC when its output stages change their status. It can reduce the power consumption and relieve the thermal problems of driver ICs.
  • Keywords
    CMOS integrated circuits; cooling; driver circuits; power integrated circuits; charge pump circuit; flat panel display; heat dissipation; high voltage CMOS driver IC; power consumption reduction;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20060754
  • Filename
    1642474