DocumentCode
968121
Title
Method of dissipating heat generated in high-voltage CMOS driver IC
Author
Do, H.-L. ; Ok, C.-Y.
Author_Institution
Digital PDP Div., LG Electron. Inc., Gongdan-Dong, South Korea
Volume
42
Issue
12
fYear
2006
fDate
6/8/2006 12:00:00 AM
Firstpage
684
Lastpage
685
Abstract
A method of dissipating the heat generated in a high-voltage CMOS driver IC, which is designed for use with a flat panel display, is proposed. It utilises a charge pump circuit to reduce the voltage across the driver IC when its output stages change their status. It can reduce the power consumption and relieve the thermal problems of driver ICs.
Keywords
CMOS integrated circuits; cooling; driver circuits; power integrated circuits; charge pump circuit; flat panel display; heat dissipation; high voltage CMOS driver IC; power consumption reduction;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20060754
Filename
1642474
Link To Document