DocumentCode
968138
Title
A New Scheme for Device Packaging
Author
Auerbach, Abraham
Author_Institution
Albany, NY
Volume
8
Issue
3
fYear
1985
fDate
9/1/1985 12:00:00 AM
Firstpage
309
Lastpage
312
Abstract
A new method for forming low resistivity conductors in a doped polymer film has been used in a novel device packaging scheme. In a first application, the focused output of a laser is used to write silver connections between device bonding pads and package conductors to fabricate a working clock.
Keywords
Integrated circuit interconnections; Interconnections, Integrated circuits; Laser applications, materials processing; Plastic materials/devices; Bonding; Clocks; Conductors; Consumer electronics; Costs; Electronics packaging; Packaging machines; Polymers; Silver; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1985.1136516
Filename
1136516
Link To Document