Surface-Soldered Pinless Module Connector

Innovation in chip design and manufacture produces an ever-increasing density in packaged circuits. This demands an increase in input/output (I/O) lines from module to printed circuit card/board. Improved wireability is also needed at the printed circuit card/board levels. Surface solder of Components allows the use of smaller vias and more lines per channel to help achieve that wireability. In addition, cost per interconnection is constantly under pressure for reduction. A pinless module interconnection system is described which addresses these concerns and outlines the design features and concepts involved in its operation. The connector uses a spring beam low-energy high-contact-stress noble metal electrical contact. The connector system features wipe for improved metal-to-metal contact, and it may be used in high density I/O grid arrangements. It is shown that a low-force, surface-soldered contact system can be used to produce a reliable high-density interconnec- tion.