DocumentCode
968417
Title
Reliability of High-Voltage LSI´s Made Using the Dielectric Isolation Process
Author
Mori, Masamichi ; Sano, Koichi
Author_Institution
NTT Corp., Kanagawa, Japan
Volume
8
Issue
4
fYear
1985
fDate
12/1/1985 12:00:00 AM
Firstpage
564
Lastpage
568
Abstract
A high-voltage subscriber-line interface large-scale integrated (LSI) circuit with high reliability is developed. To realize 350 V blocking voltage, this high-voltage LS1 is fabricated using an epitaxial passivated integrated circuit (EPIC) dielectric isolation technology and a field plate technique. Certain instabilities, such as leakage current increase and breakdown voltage decrease, has been reduced by using an n+buried layer and a field-plate structure for a low-voltage junction in the high-voltage device. This technique produces high-voltage LSI´s with long-term stability and reliability of less than 20 FIT. This is confirmed by results of a 125°C, 10 000-h operating test. It is confirmed that highvoltage LSI´s made by the EPIC dielectric isolation process are as highly reliable as low-voltage conventional bipolar LSI´s.
Keywords
Bipolar integrated circuits; Epitaxial growth; Subscriber networks; CMOS analog integrated circuits; Dielectric substrates; Integrated circuit reliability; Large scale integration; Leakage current; Magnetooptic recording; Protection; Switches; Testing; Zero voltage switching;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1985.1136544
Filename
1136544
Link To Document