• DocumentCode
    968417
  • Title

    Reliability of High-Voltage LSI´s Made Using the Dielectric Isolation Process

  • Author

    Mori, Masamichi ; Sano, Koichi

  • Author_Institution
    NTT Corp., Kanagawa, Japan
  • Volume
    8
  • Issue
    4
  • fYear
    1985
  • fDate
    12/1/1985 12:00:00 AM
  • Firstpage
    564
  • Lastpage
    568
  • Abstract
    A high-voltage subscriber-line interface large-scale integrated (LSI) circuit with high reliability is developed. To realize 350 V blocking voltage, this high-voltage LS1 is fabricated using an epitaxial passivated integrated circuit (EPIC) dielectric isolation technology and a field plate technique. Certain instabilities, such as leakage current increase and breakdown voltage decrease, has been reduced by using an n+buried layer and a field-plate structure for a low-voltage junction in the high-voltage device. This technique produces high-voltage LSI´s with long-term stability and reliability of less than 20 FIT. This is confirmed by results of a 125°C, 10 000-h operating test. It is confirmed that highvoltage LSI´s made by the EPIC dielectric isolation process are as highly reliable as low-voltage conventional bipolar LSI´s.
  • Keywords
    Bipolar integrated circuits; Epitaxial growth; Subscriber networks; CMOS analog integrated circuits; Dielectric substrates; Integrated circuit reliability; Large scale integration; Leakage current; Magnetooptic recording; Protection; Switches; Testing; Zero voltage switching;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1985.1136544
  • Filename
    1136544