Title :
Foreword: Special Issue on Hybrid Microelectronics
Author_Institution :
PHP Guest Editor 1972, Bell Labs.
fDate :
6/1/1972 12:00:00 AM
Keywords :
Ceramics; Electronic packaging thermal management; Hybrid integrated circuits; Integrated circuit interconnections; Microelectronics; Optical materials; Polyimides; Resistors; Substrates; Thin film circuits;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1972.1136558
