• DocumentCode
    968564
  • Title

    Foreword: Special Issue on Hybrid Microelectronics

  • Author

    Orr, W.

  • Author_Institution
    PHP Guest Editor 1972, Bell Labs.
  • Volume
    8
  • Issue
    2
  • fYear
    1972
  • fDate
    6/1/1972 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    3
  • Keywords
    Ceramics; Electronic packaging thermal management; Hybrid integrated circuits; Integrated circuit interconnections; Microelectronics; Optical materials; Polyimides; Resistors; Substrates; Thin film circuits;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1972.1136558
  • Filename
    1136558
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=968564