Title :
Development of Large Thick-Film Multilayer Assemblies
Author :
Issak, H. ; Kanz, J. ; Babiracki, E.G.
Author_Institution :
McDonnell Douglas Corp.
fDate :
6/1/1972 12:00:00 AM
Keywords :
Aerospace electronics; Assembly; Conducting materials; Dielectric materials; Dielectric substrates; Electronics packaging; Firing; Glass; Integrated circuit interconnections; Nonhomogeneous media;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1972.1136564
