DocumentCode

968650

Title

Bonded Crossovers for Thin Film Circuits

Author

Burns, J.A.

Author_Institution

Western Elec. Co., Inc.

Volume

8

Issue

2

fYear

1972

fDate

6/1/1972 12:00:00 AM

Firstpage

35

Lastpage

38

Keywords

Bonding; Copper; Etching; Gold; Manufacturing; Polyimides; Resists; Solid state circuits; Substrates; Thin film circuits;

fLanguage

English

Journal_Title

Parts, Hybrids, and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0361-1000

Type

jour

DOI

10.1109/TPHP.1972.1136566

Filename

1136566