DocumentCode :
968713
Title :
Foreword: Special Issue on Hybrid Microelectronics
Author :
Sobol, H.
Author_Institution :
Guest Editor
Volume :
8
Issue :
3
fYear :
1972
fDate :
9/1/1972 12:00:00 AM
Firstpage :
3
Lastpage :
3
Keywords :
Bonding; Circuits; Electronic components; Electronics industry; Electronics packaging; Microelectronics; Silicon; Sputtering; Substrates; Transactions Committee;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1972.1136573
Filename :
1136573
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=968713
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