Glass-Sealed Leads on Electric Components

Industry specialists do most of the fabrication of glass-sealed headers for suppliers of hermetic electronic components. Too often, these specialists are not acquainted with the effect that header processing can have on component fabrication, assembly or use. Almost as frequently, the component maker is unable to relate his own processing difficulties to problems introduced during the previous handling of subassemblies. This paper presents an analysis of the effect that the oxidation of leads prior to glass sealing has on component assembly and use. Metallographic techniques are useful for the control of affected component parts. Some examples of the use of metallography for the evaluation of glass-metal seals are shown.