DocumentCode :
969554
Title :
Cooling - Hot zones
Author :
Dubin, Israel
Volume :
4
Issue :
6
fYear :
2006
Firstpage :
34
Lastpage :
39
Abstract :
With densely populated boards such as COM-Express modules, you need to look carefully at the system design to ensure that you are taking the heat away effectively. If you don´t, you could find the design is less reliable than it ought to be. A frequently cited benefit of reduced processor size is reduced power consumption. But this is really only true at the level of the individual devices within the chip. The overall power reduction has not progressed at the rate of miniaturisation. As processors became smaller, we have packed more heat generation into that smaller space and the devices now run hotter. With this higher performance, thermal management needs to be addressed, especially in embedded computers that operate in warm environments inside a closed chassis or other densely packed enclosures
Keywords :
modules; thermal management (packaging); closed chassis; densely packed enclosures; embedded computers; heat generation; power reduction; processors miniaturisation; system design; thermal management;
fLanguage :
English
Journal_Title :
Electronics Systems and Software
Publisher :
iet
ISSN :
1479-8336
Type :
jour
Filename :
4064887
Link To Document :
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