Title :
A 5-GHz Mesh Interconnect for a Teraflops Processor
Author :
Hoskote, Y. ; Vangal, S. ; Singh, A. ; Borkar, N. ; Borkar, S.
Author_Institution :
Intel Corp., Hillsboro
Abstract :
A multicore processor in 65-Nm technology with 80 single-precision, floatingpoint cores delivers performance in excess of a Teraflops while consuming less than 100 W. A 2D on-die mesh interconnection network operating at 5 GHz provides the high-performance communication fabric to connect the cores. The network delivers a bisection bandwidth of 2.56 Terabits per second and a per hop fall-through latency of 1 nanosecond.
Keywords :
logic design; multiprocessor interconnection networks; network-on-chip; 2D on-die mesh interconnection network; Teraflops processor; bisection bandwidth; frequency 5 GHz; multicore processor; network-on-chip; Bandwidth; Delay; Engines; Intelligent networks; Multiprocessor interconnection networks; Network-on-a-chip; Power dissipation; Scalability; CMOS digital integrated circuits; crossbar; interconnection fabric; mesh; network on chip; router;
Journal_Title :
Micro, IEEE
DOI :
10.1109/MM.2007.4378783
