• DocumentCode
    969721
  • Title

    Fatigue of 60/40 Solder

  • Author

    Solomon, Harvey D.

  • Author_Institution
    General Electric Company, NY
  • Volume
    9
  • Issue
    4
  • fYear
    1986
  • fDate
    12/1/1986 12:00:00 AM
  • Firstpage
    423
  • Lastpage
    432
  • Abstract
    Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results are obtained when total strain limits are employed. This difference is discussed. The influence of cycling frequency and temperature changes are also discussed. A model is presented which describes the influence of plastic strain and cycling frequency. Corrections to the model predicted fatigue life, which account for temperature changes, cycling waveshape, and joint geometries, are also discussed.
  • Keywords
    Integrated circuit bonding; Integrated circuit reliability; Mechanical factors; Capacitive sensors; Fatigue; Frequency; Plastics; Predictive models; Soldering; Strain control; Temperature distribution; Testing; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1986.1136672
  • Filename
    1136672