DocumentCode :
969721
Title :
Fatigue of 60/40 Solder
Author :
Solomon, Harvey D.
Author_Institution :
General Electric Company, NY
Volume :
9
Issue :
4
fYear :
1986
fDate :
12/1/1986 12:00:00 AM
Firstpage :
423
Lastpage :
432
Abstract :
Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results are obtained when total strain limits are employed. This difference is discussed. The influence of cycling frequency and temperature changes are also discussed. A model is presented which describes the influence of plastic strain and cycling frequency. Corrections to the model predicted fatigue life, which account for temperature changes, cycling waveshape, and joint geometries, are also discussed.
Keywords :
Integrated circuit bonding; Integrated circuit reliability; Mechanical factors; Capacitive sensors; Fatigue; Frequency; Plastics; Predictive models; Soldering; Strain control; Temperature distribution; Testing; Thermal stresses;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1986.1136672
Filename :
1136672
Link To Document :
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