DocumentCode
969721
Title
Fatigue of 60/40 Solder
Author
Solomon, Harvey D.
Author_Institution
General Electric Company, NY
Volume
9
Issue
4
fYear
1986
fDate
12/1/1986 12:00:00 AM
Firstpage
423
Lastpage
432
Abstract
Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results are obtained when total strain limits are employed. This difference is discussed. The influence of cycling frequency and temperature changes are also discussed. A model is presented which describes the influence of plastic strain and cycling frequency. Corrections to the model predicted fatigue life, which account for temperature changes, cycling waveshape, and joint geometries, are also discussed.
Keywords
Integrated circuit bonding; Integrated circuit reliability; Mechanical factors; Capacitive sensors; Fatigue; Frequency; Plastics; Predictive models; Soldering; Strain control; Temperature distribution; Testing; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1986.1136672
Filename
1136672
Link To Document