Title :
Composite- Type pin Grid Array package
Author :
Tsutsumi, Kazuhito ; Kohara, Masanobu ; Shinoya, Yoshiyuki ; Tada, Tetsuo ; Sakashita, Kazuhiro ; Shibata, Hiroshi ; Nakata, Hidefumi
Author_Institution :
Mitsubishi Electronic Corp., Japan
fDate :
12/1/1986 12:00:00 AM
Abstract :
A composite pin grid array (PGA) package was developed. This package is composed of the base, the polyimide film with the wiring paths of copper, and the cap. An attractive feature of this package is its electrical performance. Moreover, this package is suitable both for customization and for mass production at relatively low cost with reduced lead time from design to production.
Keywords :
High-speed integrated circuits; Integrated circuit packaging; Bonding; Ceramics; Costs; Electronics packaging; Gold; Integrated circuit packaging; Pins; Tungsten; Very large scale integration; Wiring;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1986.1136688
