Title :
The influence of boundary locations on wiring capacitance simulation
Author :
Shigyo, Naoyuki ; Fukuda, Sanae ; Kat, Koichi
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fDate :
6/1/1989 12:00:00 AM
Abstract :
The influence of boundary conditions on periodic wiring capacitance simulations is investigated. It is found that the wiring capacitance depends strongly on the boundary locations. The Neumann boundary condition is used at the planes of symmetry which bound the calculation region. For simulating a periodic wiring pattern, the Neumann boundary plane is usually placed at the center of an electrode. However, when the Neumann boundary plane is placed at the center of an insulator between neighboring electrodes, the simulated capacitance becomes 20% larger than that for the usual boundary location. This discrepancy is analyzed and a novel technique for calculating accurate capacitances is proposed
Keywords :
VLSI; capacitance; circuit analysis computing; metallisation; Neumann boundary condition; Neumann boundary plane; VLSI design; boundary locations; discrepancy; influence of boundary locations; periodic wiring capacitance simulations; periodic wiring pattern; planes of symmetry; technique for calculating accurate capacitances; Boundary conditions; Capacitance; Electrodes; Geometry; Insulation; Laplace equations; Ultra large scale integration; Very large scale integration; Voltage; Wiring;
Journal_Title :
Electron Devices, IEEE Transactions on