DocumentCode :
969922
Title :
Transparency maximization methodology for haptic devices
Author :
Vlachos, Kostas ; Papadopoulos, Evangelos
Author_Institution :
Dept. of Mech. Eng., Nat. Tech. Univ. of Athens, Greece
Volume :
11
Issue :
3
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
249
Lastpage :
255
Abstract :
In this paper, a design methodology is presented aimed at maximizing haptic device transparency, as seen from the user side. The methodology developed focuses on endpoint side fidelity, and optimizes not only mechanism dimensions, but also all relevant design parameters including relative position of endpoint desired path to device location, motor transmission ratios, and rotor inertias or motor sizes. The methodology is applied to a 5-degree-of-freedom (5-DOF) haptic device, part of a training medical urological simulator, and is applicable to any haptic mechanism. The transparency maximization is achieved using a multivariable optimization approach and an objective function including mechanism-induced parasitic torques/forces and motor and transmission parameters, as seen from the user side, under several constraints. The objective function and the kinematical and operational constraints are described and discussed. A new 5-DOF haptic mechanism is constructed according to the developed procedure, resulting in a substantially improved device with respect to an existing one, developed with a standard optimization method.
Keywords :
control engineering computing; digital simulation; haptic interfaces; manipulators; medical computing; medical robotics; endpoint side fidelity; haptic devices; medical urological simulator; motor sizes; motor transmission ratios; rotor inertias; transparency maximization method; Acceleration; Constraint optimization; Design methodology; Design optimization; Friction; Haptic interfaces; Jacobian matrices; Medical simulation; Optimization methods; Rotors; Haptic devices; multivariable optimization; training medical simulators;
fLanguage :
English
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
Publisher :
ieee
ISSN :
1083-4435
Type :
jour
DOI :
10.1109/TMECH.2006.875561
Filename :
1642686
Link To Document :
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