DocumentCode
969933
Title
Suction vs. Pressure Forced Air Cooling
Author
Rezek, Gerard
Volume
9
Issue
1
fYear
1965
fDate
4/1/1965 12:00:00 AM
Firstpage
30
Lastpage
35
Abstract
The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretion at the air exit, which is a critical area. That suction cooling will minimize air temperatures in that area is qualitatively developed and then quantitatively analyzed.
Keywords
Assembly; Circuits; Electronic equipment; Electronics cooling; Insulation; Linearity; Modular construction; Pattern analysis; Space cooling; Temperature;
fLanguage
English
Journal_Title
Product Engineering and Production, IEEE Transactions on
Publisher
ieee
ISSN
0097-4544
Type
jour
DOI
10.1109/TPEP.1965.1136694
Filename
1136694
Link To Document