DocumentCode :
970162
Title :
A Stability Study of Laser-Patterned Thermally Stabilized Tantalum Nitride and Tantalum Aluminum Films
Author :
Barlage, F. Michael
Author_Institution :
Western Elec. Eng. Research Center, NJ
Volume :
9
Issue :
2
fYear :
1973
fDate :
6/1/1973 12:00:00 AM
Firstpage :
123
Lastpage :
130
Abstract :
Tantalum nitride and tantalum aluminum thin-film power resistors were reactively sputtered on 99+ percent alumina ceramic substrates in an argon atmosphere, thermally stabilized, and laser patterned into serpentine paths (two to ten meanders) to obtain final values two to two hundred times their initial values. The resistors were then subjected to many tests to determine their stability. Data from the load life test, after 5000 h at 13.3 W/in2 in a 66°C ambient, indicate that thermally stabilized tantalum nitride and tantalure aluminum resistors may be laser patterned without affecting the films´ intrinsic stability, provided certain constraints in the resistors´ geometry are recognized and observed by the designer.
Keywords :
Laser machining; Tantalum nitride films; Tantalum-aluminum films; Thin-film resistors; Aluminum; Argon; Atmosphere; Ceramics; Laser stability; Resistors; Sputtering; Substrates; Thermal resistance; Thermal stability;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1973.1136717
Filename :
1136717
Link To Document :
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