DocumentCode
970311
Title
Copper Alloy Spring Materials and Spring Properties
Author
Schlabach, T.D.
Author_Institution
Bell Lab., NJ
Volume
9
Issue
4
fYear
1973
fDate
12/1/1973 12:00:00 AM
Firstpage
237
Lastpage
242
Abstract
Copper alloys have long served as spring materials in electromechanical devices, but the miniaturization of electronic equipment has imposed new demands on these materials. The first is that of improved elastic properties to ensure satisfactory performance at the higher operating stresses and temperatures encountered in these miniaturized devices. The second is that of improved methods for characterizing those spring properties of design interest in light of the more stringent operating margins encountered in these devices. Some of the newer alloys, processing methods, and strengthening mechanisms being employed to provide copper alloys with improved elastic properties are reviewed. Thermomechanical processing is shown to be a particularly effective means for achieving high strengths in a variety of copper alloys. New methods for characterizing the elastic properties of spring materials are discussed and compared to traditional methods based on tension tests.
Keywords
Copper alloys; Springs; Copper alloys; Electromechanical devices; Electronic equipment; Fatigue; Mechanical factors; Springs; Stress; Structural beams; Temperature; Testing;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1973.1136733
Filename
1136733
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