DocumentCode :
971160
Title :
Pulsed thermal annealing of arsenic-implanted silicon
Author :
Scovell, P.D.
Author_Institution :
Standard Telecommunication Laboratories Ltd., Harlow, UK
Volume :
17
Issue :
12
fYear :
1981
Firstpage :
403
Lastpage :
405
Abstract :
A pulsed thermal annealing system is described which rapidly heats samples to 700°C and can successfully activate and regrow arsenic-implanted damaged layers. The junctions so formed are shown to be of low resistivity and exhibit very good diode characteristics. Residual damage seen after the anneal does not appear to degrade the junction performance.
Keywords :
annealing; arsenic; elemental semiconductors; ion implantation; semiconductor doping; silicon; Si:As; diode characteristics; elemental semiconductors; pulsed thermal annealing;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19810280
Filename :
4245751
Link To Document :
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