Title :
Reliability of AuGe/Pt and AuGe/Ni ohmic contacts on GaAs
Author :
Lee, Charlotte P. ; Welch, B.M. ; Fleming, W.P.
Author_Institution :
Rockwell International, Microelectronics Research & Development Center, Thousand Oaks, USA
Abstract :
The reliability of AuGe/Pt and AuGe/Ni ohmic contacts with and without overlay metal (Ti/Au, Ti/Pt/Au or TiW/Au) has been studied. AuGe/Ni contacts have proved superior and more reliable than AuGe/Pt contacts with or without overlay. AuGe/Pt contacts are stable without overlay but degrade rapidly with overlay. AuGe/Ni contacts exhibit thermal stability after 1000 hours´ aging at 250°C.
Keywords :
gold compounds; nickel; ohmic contacts; platinum; reliability; AuGe-Ni ohmic contacts; AuGe-Pt ohmic contacts; GaAs; Ti-Au; Ti-Pt-Au; TiW-Au; reliability;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19810283
