• DocumentCode
    971557
  • Title

    Embedded optical interconnections using thin film InGaAs metal-semiconductor-metal photodetectors

  • Author

    Huang, Z. ; Ueno, Y. ; Kaneko, K. ; Jokerst, N.M. ; Tanahashi, S.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    38
  • Issue
    25
  • fYear
    2002
  • fDate
    12/5/2002 12:00:00 AM
  • Firstpage
    1708
  • Lastpage
    1709
  • Abstract
    The integration of InGaAs photodetectors embedded in a polymer interconnection waveguide on Si and ceramic electrical interconnection substrates has been demonstrated. The photodetector and substrate are independently fabricated and bonded, with subsequent waveguide integration. The embedding fabrication process, coupling, and bandwidth are reported at 1 Gbit/s.
  • Keywords
    III-V semiconductors; gallium arsenide; indium compounds; integrated circuit interconnections; metal-semiconductor-metal structures; optical couplers; optical interconnections; photodetectors; 1 Gbit/s; InGaAs; bandwidth; coupling; electrical interconnection substrates; embedded optical interconnections; fabrication process; interconnect design; metal-semiconductor-metal photodetectors; millihaul interconnections; polymer interconnection waveguide; waveguide integration;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20021047
  • Filename
    1137479